发明名称 POLYAMIDEIMIDE RESIN AND SEAMLESS BELT USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a polyamideimide resin which is excellent in low water absorption and solvent solubility and useful for a seamless belt for an electrophotographic apparatus or the like without impairing heat resistance (glass transition temperature) or mechanical properties (tensile strength and tear strength).SOLUTION: There is provided a polyamideimide resin containing 10 to 90 mol% of a constitutional unit represented by the following formula (1) in the polyamideimide resin. (where, Rrepresents an alkyl group having 1 to 5 carbon atoms or -SO-; Rand Rmay be the same or different and each represents hydrogen, a halogen atom, an aryl group or an alkyl group having 1 to 3 carbon atoms, provided that when Ris SO-, Rand Rare not present; and Rrepresents an aryl group which may have a substituent.)
申请公布号 JP2015199858(A) 申请公布日期 2015.11.12
申请号 JP20140080171 申请日期 2014.04.09
申请人 TOYOBO CO LTD 发明人 SHINO KATSUYA;HATSUTORI TAKAHIRO;IENE TAKEHISA;TANIGAWA MASATO;HAMANO SHIGEYOSHI
分类号 C08G73/14;C08G18/34;C08K3/04;G03G15/16;H01B1/24 主分类号 C08G73/14
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