发明名称 COMPOSITE INTEGRATED CIRCUITS AND METHODS FOR WIRELESS INTERACTIONS THEREWITH
摘要 A composite integrated circuit (IC) includes a first circuit layer, a second circuit layer having a first chip and a second chip, and a first wireless power transfer (WPT) device in the first chip or the first circuit layer. The first WPT device generates a power supply voltage by extracting energy from an electromagnetic signal. A first tracking circuit in the second chip or the first circuit layer is powered by the power supply voltage from the first WPT device and stores or outputs tracking data in response to an instruction extracted from the electromagnetic signal.
申请公布号 US2015323589(A1) 申请公布日期 2015.11.12
申请号 US201514804319 申请日期 2015.07.20
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 Wang Min-Jer;PENG Ching-Nen;JOU Chewn-Pu;KUO Feng Wei;CHEN Hao;LIN Hung-Chih;CHEN Huan-Neng;YEN Kuang-Kai;LIU Ming-Chieh;LEE Tsung-Hsiung
分类号 G01R31/28;H01L23/538;H02J5/00;H01L25/065 主分类号 G01R31/28
代理机构 代理人
主权项 1. A composite integrated circuit (IC), comprising: a first circuit layer; a second circuit layer comprising a first chip and a second chip; a first wireless power transfer (WPT) device in the first chip or the first circuit layer, the first WPT device configured to generate a power supply voltage by extracting energy from an electromagnetic signal; and a first tracking circuit in the second chip or the first circuit layer, the first tracking circuit configured to be powered by the power supply voltage from the first WPT device and to store or output tracking data in response to an instruction extracted from the electromagnetic signal.
地址 Hsinchu TW