| 摘要 |
This method for manufacturing a wire bonding structure is provided with: a step for preparing a wire formed of Cu; and a step for bonding the wire to a first subject to be bonded to, said first subject being formed on an electronic element. Prior to the bonding step, the wire has an outer circumferential surface and a retracted surface. The retracted surface is a surface retracted to the center axis side of the wire from the outer circumferential surface. In the bonding step, ultrasonic vibration is applied to the wire in a state wherein the retracted surface is pressed to the first subject. |
