发明名称 CARRIER-PROVIDED COPPER FOIL, PRINTED WIRING BOARD, LAMINATE SHEET, ELECTRONIC EQUIPMENT, LAMINATE AND METHOD OF PRODUCING PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide carrier-provided copper foil having good circuit formability.SOLUTION: Carrier-provided copper foil has a carrier, an intermediate layer and a very thin copper layer, in this order, and the intermediate layer contains Ni. When the carrier is peeled from the carrier-provided copper foil, the average value of the abundance ratio of nickel oxide and nickel hydroxide in Ni, (NiO+Ni(OH))/Ni, is 5-50%, determined by XPS analysis of the surface of the carrier on the side of the intermediate layer.
申请公布号 JP2015200025(A) 申请公布日期 2015.11.12
申请号 JP20150074321 申请日期 2015.03.31
申请人 JX NIPPON MINING & METALS CORP 发明人 HONDA MISATO;ISHII MASASHI;MIYAMOTO NOBUAKI
分类号 C25D1/04;B32B15/01;C23C28/00;C25D5/12;C25D7/06;H05K1/09 主分类号 C25D1/04
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