发明名称 |
CARRIER-PROVIDED COPPER FOIL, PRINTED WIRING BOARD, LAMINATE SHEET, ELECTRONIC EQUIPMENT, LAMINATE AND METHOD OF PRODUCING PRINTED WIRING BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide carrier-provided copper foil having good circuit formability.SOLUTION: Carrier-provided copper foil has a carrier, an intermediate layer and a very thin copper layer, in this order, and the intermediate layer contains Ni. When the carrier is peeled from the carrier-provided copper foil, the average value of the abundance ratio of nickel oxide and nickel hydroxide in Ni, (NiO+Ni(OH))/Ni, is 5-50%, determined by XPS analysis of the surface of the carrier on the side of the intermediate layer. |
申请公布号 |
JP2015200025(A) |
申请公布日期 |
2015.11.12 |
申请号 |
JP20150074321 |
申请日期 |
2015.03.31 |
申请人 |
JX NIPPON MINING & METALS CORP |
发明人 |
HONDA MISATO;ISHII MASASHI;MIYAMOTO NOBUAKI |
分类号 |
C25D1/04;B32B15/01;C23C28/00;C25D5/12;C25D7/06;H05K1/09 |
主分类号 |
C25D1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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