Inspection Recipe Setup from Reference Image Variation

摘要

Systems and methods for generating information for use in a wafer inspection process are provided. One method includes acquiring output of an inspection system for die(s) located on wafer(s), combining the output for the die(s) based on within die positions of the output, determining, on a within die position basis, a statistical property of variation in values of characteristic(s) of the combined output, and assigning the within die positions to different groups based on the statistical properties determined for the within die positions. The method also includes storing information for the within die positions and the different groups to which the within die positions are assigned in a storage medium that is accessible to the inspection system for performing the wafer inspection process, which includes applying defect detection parameter(s) to additional output of the inspection system generated for a wafer based on the information thereby detecting defects on the wafer.

主权项

1. A computer-implemented method for generating information for use in a wafer inspection process, comprising:
acquiring output of an inspection system for one or more dies located on one or more wafers; combining the output for the one or more dies based on within die positions of the output; determining, on a within die position basis, a statistical property of variation in values of one or more characteristics of the combined output; assigning the within die positions to different groups based on the statistical properties determined for the within die positions; and storing information for the within die positions and the different groups to which the within die positions are assigned in a storage medium that is accessible to the inspection system for performing the wafer inspection process, wherein the wafer inspection process comprises applying one or more defect detection parameters to additional output of the inspection system generated for a wafer based on the information to thereby detect defects on the wafer, and wherein said acquiring, said combining, said determining, said assigning, and said storing are performed by a computer system.