PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, AND ELECTRONIC DEVICE

摘要

The present invention provides a photosensitive resin composition which comprises an alkali-soluble resin (A), a silane compound (B) represented by the following general formula (1), and a photo-acid generator (C). A[Si(R1)a(OR2)b]m[Si(R3)c(OR4)d]n (1) (In the formula, A represents an organic group that has a cyclic structure and a valence of (m+n); R1 and R3 each independently represent a hydrogen atom or an (un)substituted C1-10 saturated alkyl group; R2 and R4 each represent an (un)substituted C1-10 saturated alkyl group or an (un)substituted C1-10 unsaturated alkyl group; a and b are integers of 0-3 which satisfy a+b=3; c and d are integers of 0-3 which satisfy c+d=3; and m and n are integers of 0-2 which satisfy m+n≠0.)