| 摘要 |
PROBLEM TO BE SOLVED: To provide a plasma processing method and a plasma processing apparatus, which can achieve improvement of manufacturing efficiency and reduction in a manufacturing cost compared with a conventional case.SOLUTION: In a plasma processing method, by energizing coils 61-64 to generate magnetic field by using a plasma processing apparatus 10 comprising an electric magnet 30 which is arranged above a processing chamber 12, and arranged to be located outside a periphery of a processed substrate (semiconductor wafer) W and has the annular coils 61-64, an interface of plasma sheath formed above a processed substrate W and above a focus ring 26 is planarized. |
