发明名称 LASER PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a laser processing device capable of effectively disposing of molten material (debris) generated by irradiating a workpiece with a laser beam from a light collector, and forming a laser processed groove having a desired depth.SOLUTION: The laser processing device includes: laser beam irradiation means; and a condensing lens for condensing a laser beam. The laser processing device further includes molten material disposal means 7 provided downstream of a light collector 53 in a laser beam irradiation direction, for disposing of molten material generated by the laser processing. The molten material disposal means 7 includes: a gas injection part 71 having an opening for allowing the passage of the laser beam emitted from the light collector 53, for injecting high speed gas from the opening toward a workpiece; and a molten material suction part 72 having a suction port 721 provided so as to surround the opening of the gas injection part 71, for sucking the molten material scattered by the high speed gas injected from the opening. The gas injection part 71 is connected to high pressure gas supply means, and the molten material suction part 72 is connected to molten material suction means.
申请公布号 JP2015199080(A) 申请公布日期 2015.11.12
申请号 JP20140078505 申请日期 2014.04.07
申请人 DISCO ABRASIVE SYST LTD 发明人 AIKAWA RIKI;OGAWA YUKI;MATSUMOTO KOICHI
分类号 B23K26/142;B23K26/00 主分类号 B23K26/142
代理机构 代理人
主权项
地址