RADIO COMMUNICATION CIRCUIT AND INTEGRATED CIRCUIT

摘要

PROBLEM TO BE SOLVED: To provide a radio communication apparatus which cancels signal leakage in radio communication between laminated chips and between the chip and a substrate in an integrated circuit where a plurality of chips are laminated.SOLUTION: The radio communication apparatus is configured to perform communication between the laminated chips and between the chip and the substrate through capacitive coupling or inductive coupling. The radio communication apparatus includes: the substrate including a high effective dielectric constant area or a high effective permeability area; a transmitter formed from a transmission circuit mounted on the substrate, a transmission antenna and a transmission antenna area surface where the transmission antenna is disposed; and a receiver formed from a reception circuit mounted on the chip, a reception antenna and a reception antenna area surface where the reception antenna is disposed.