发明名称 METHOD FOR CONNECTING PIEZOELECTRIC ELEMENT AND CABLE SUBSTRATE, PIEZOELECTRIC ELEMENT HAVING CABLE SUBSTRATE, AND INKJET HEAD INCLUDING PIEZOELECTRIC ELEMENT WITH CABLE SUBSTRATE
摘要 A connection method disclosed herein includes softening a resin film of a thermosetting resin by heating an element electrode of a piezoelectric body and a substrate electrode of a flexible cable to be connected to the piezoelectric body with the element electrode and the substrate electrode being pressed into contact with each other via the resin film; partially pushing out the molten resin film from an opposing position of the element electrode and the substrate electrode so as to bring a solder layer provided on the substrate electrode into contact with the element electrode; curing the resin film and melting solder in the solder layer by further raising a heating temperature; discharging excess solder in a direction defined by the cured resin film; and then solidifying the solder in the solder layer so as to solder the element electrode and the substrate electrode together.
申请公布号 US2015325777(A1) 申请公布日期 2015.11.12
申请号 US201514707101 申请日期 2015.05.08
申请人 Panasonic Intellectual Property Management Co., Ltd. 发明人 IRIE Kazunobu;OHTSUKA Futoshi;KITA Takeshi;HATANAKA Motoi
分类号 H01L41/047;B23K31/02;B23K1/00;H01L41/053;B41J2/14 主分类号 H01L41/047
代理机构 代理人
主权项 1. A method for connecting a piezoelectric element and a cable substrate, the method comprising: softening a resin film by pressing against each other and heating a plurality of element electrodes located at the piezoelectric element and a plurality of substrate electrodes located on the cable substrate with the resin film and solder being sandwiched between the plurality of element electrodes and the plurality of substrate electrodes, each of the plurality of substrate electrodes having a shape of a line; curing the resin film by further heating the resin film that has been softened; melting the solder, and pushing out along the line a portion of the solder located at an opposing position by the pressing, the opposing position being a position where the plurality of element electrodes and the plurality of substrate electrodes are opposed to each other; and solidifying the solder between the plurality of substrate electrodes and the plurality of element electrodes.
地址 Osaka JP