| 摘要 |
PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition which can provide a cured film realizing inhibited warpage, little residual stress and excellent physical properties with a curing temperature of 300°C or less; a patterned cured film using the same; and a production method thereof.SOLUTION: A positive photosensitive resin composition comprises (A) at least one polymer selected from the group consisting of polyimide, polybenzoxazole and precursors thereof, (B) a compound that generates an acid upon irradiation with light, (C) a thermal crosslinking agent, and (D) an acrylic resin including a structure represented by the general formula (1). (In the general formula (1), Rrepresents hydrogen or a methyl group; and Rrepresents a hydrogen atom, a hydroxyl group, a C1-12 alkyl group, alkoxyl group, or a carboxyl group.) |
