发明名称 POLYAMIDE RESIN COMPOSITION AND MOLDED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition having excellent heat aging resistance and a molded product thereof.SOLUTION: A polyamide resin composition comprises (A) polyamide resin, (B) metal aluminate, and (C) polyethyleneimine polymer, and has Mw/Mn of 2.0 or more, and also has Mw/Mn of 3.0 or more after heat aging for 1000 hours at 120°C.
申请公布号 JP2015199938(A) 申请公布日期 2015.11.12
申请号 JP20150069747 申请日期 2015.03.30
申请人 ASAHI KASEI CHEMICALS CORP 发明人 KAWAMURA TOMOYO;WATANABE KATSUSHI
分类号 C08L77/00;C08K3/00;C08K3/24;C08L79/02 主分类号 C08L77/00
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