| 发明名称 |
HEAT SINK FOR OPTICAL MODULE ARRAY ASSEMBLY |
| 摘要 |
Apparatus comprising: a heat sink, the heat sink comprising: a body formed out of a heat-transmissive material; at least one channel extending through the body, the at least one channel having an inlet port and an outlet port; at least one opening extending through the body, the at least one opening being configured to receive an optical module therein; at least one securement element mounted to the body for releasably securing an optical module within the at least one opening; and at least one alignment element mounted to the body for ensuring appropriate alignment of an optical module received in the at least one opening. |
| 申请公布号 |
US2015323751(A1) |
申请公布日期 |
2015.11.12 |
| 申请号 |
US201514705189 |
申请日期 |
2015.05.06 |
| 申请人 |
ProPhotonix Limited |
发明人 |
Zagoneanu Adrian |
| 分类号 |
G02B6/42 |
主分类号 |
G02B6/42 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. Apparatus comprising:
a heat sink, said heat sink comprising:
a body formed out of a heat-transmissive material;at least one channel extending through said body, said at least one channel having an inlet port and an outlet port;at least one opening extending through said body, said at least one opening being configured to receive an optical module therein;at least one securement element mounted to said body for releasably securing an optical module within said at least one opening; andat least one alignment element mounted to said body for ensuring appropriate alignment of an optical module received in said at least one opening. |
| 地址 |
Salem NH US |
