| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper alloy for solder joint which can suppress discoloration due to heating oxidation or the like in the atmosphere and exhibits superior solder wettability even after heating.SOLUTION: A copper alloy for solder joint primarily comprises copper, and contains nickel of 10 to 35 mass% and silver of 1 to 20 mass%. In the copper alloy for solder joint, a contact angle between the copper alloy and a solder bath brought into contact with each other in a heat equilibrium state which is measured according to a test method based on JIS C 60068-2-54 by using Sn-3.5 mass Ag-0.5 mass% Cu solder bath to be molten at 245°C is 90° or less. |
