EMBEDDED PACKAGE AND METHOD THEREOF

摘要

The present invention discloses a new embedded package comprising: a pre-mold lead frame with a plurality of chips attached thereon, where the molding material fills the voids of the lead frame, so that the lead frame is entirely solid; a plurality of pins arranged around the lead frame; a metal clip attached on and electrically connecting the chips together; first laminate layer which covers the chips, the lead frame, a metal clip and pins; conductive plug and extension formed to connect an electrode of a chip to a corresponding pin or to connect the chips together. The new embedded package of the invention with a three-dimensional stack capacity improves the thickness, thermal and electrical properties and the flexible power and logic hybrid design.

主权项

1. A new embedded package comprising:
a pre-mold lead frame and a plurality of chips attached thereon; a plurality of pins arranged around the lead frame; mold material filled in a void of the lead frame so that the lead frame is entirety solid; a clip attached on a portion of each chip, wherein the plurality of chips are electrically connected to each other through the clip and one end of the clip is electrically connected with a pin; a first lamination layer covering the plurality of chips, the lead frame, the clip and the pins; a via formed at an area above an electrode of each chip and above each corresponding pin, through the first lamination layer from the top surface of the chip or the pin to the top surface of the first lamination layer; the via filled with a conductive material to form a conductive plug; the conductive plug above the electrode of each chip is electrically connected with the conductive plug on the corresponding pin and, each chip is electrically connected with the other chips through the corresponding conductive plug.