PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

摘要

A package structure is provided, which includes: a chip carrier having a plurality of conductive connection portions; at least an electronic element disposed on the chip carrier; a plurality of conductive wires erectly positioned on the conductive connection portions, respectively; an encapsulant formed on the chip carrier for encapsulating the conductive wires and the electronic element, wherein one ends of the conductive wires are exposed from the encapsulant; and a circuit layer formed on the encapsulant and electrically connected to exposed ends of the conductive wires. According to the present invention, the conductive wires serve as an interconnection structure. Since the wire diameter of the conductive wires is small and the pitch between the conductive wires can be minimized, the present invention reduces the size of the chip carrier and meets the miniaturization requirement.

主权项

1. A package structure, comprising:
a chip carrier having a plurality of conductive connection portions; at least an electronic element disposed on the chip carrier; a plurality of conductive wires erectly positioned on the conductive connection portions, respectively, wherein each of the conductive wires has opposite first and second ends and the conductive wires are bonded to the conductive connection portions via the first ends thereof; an encapsulant formed on the chip carrier for encapsulating the conductive wires and the electronic element, wherein the encapsulant has opposite first and second surfaces, the encapsulant is bonded to the chip carrier and the conductive connection portions via the first surface thereof, and the second ends of at least a certain number of the conductive wires are exposed from the second surface of the encapsulant; and a circuit layer formed on the second surface of the encapsulant and electrically connected to the exposed second ends of the conductive wires.