发明名称 HIGH DENSITY SRAM ARRAY DESIGN WITH SKIPPED, INTER-LAYER CONDUCTIVE CONTACTS
摘要 A static random access memory (SRAM) cell includes a first conductive layer including a wordline landing pad extending into a neighboring memory cell in an adjacent row of a memory array. The wordline landing pad in the first conductive layer is electrically isolated from all gate contacts of the neighboring memory cell. The SRAM cell also includes a second conductive layer including a wordline coupled to the wordline landing pad in the first conductive layer. The SRAM cell further includes a first via coupling a gate contact of a pass transistor gate in the SRAM cell to the wordline landing pad in the first conductive layer. The SRAM cell also includes a second via coupling the wordline landing pad and the wordline of the second conductive layer.
申请公布号 US2015325514(A1) 申请公布日期 2015.11.12
申请号 US201414274378 申请日期 2014.05.09
申请人 QUALCOMM Incorporated 发明人 MOJUMDER Niladri Narayan;WANG Zhongze;SONG Stanley Seungchul;YEAP Choh Fei
分类号 H01L23/522;H01L21/768;H01L27/11 主分类号 H01L23/522
代理机构 代理人
主权项 1. A static random access memory (SRAM) cell, comprising: a first conductive layer including a wordline landing pad extending into a neighboring memory cell in an adjacent row of a memory array, the wordline landing pad in the first conductive layer being electrically isolated from all gate contacts of the neighboring memory cell; a second conductive layer including a wordline coupled to the wordline landing pad in the first conductive layer; a first via coupling a gate contact of a pass transistor gate in the SRAM cell to the wordline landing pad in the first conductive layer; and a second via coupling the wordline landing pad and the wordline of the second conductive layer.
地址 San Diego CA US