| 发明名称 |
SEMICONDUCTOR DEVICE |
| 摘要 |
A semiconductor device is provided with a semiconductor element, a main lead on which the semiconductor element is disposed, and a resin package that covers the semiconductor element and the main lead. A notch that is recessed toward the center of the main lead in plan view as seen in the thickness direction of the semiconductor element is formed in the main lead. |
| 申请公布号 |
US2015325504(A1) |
申请公布日期 |
2015.11.12 |
| 申请号 |
US201514708962 |
申请日期 |
2015.05.11 |
| 申请人 |
ROHM CO., LTD. |
发明人 |
ISE Kota |
| 分类号 |
H01L23/495;H01L23/00;H01L23/31 |
主分类号 |
H01L23/495 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a semiconductor element; a main lead on which the semiconductor element is disposed; and a resin package covering the semiconductor element and the main lead, wherein the main lead is formed with a notch recessed toward a center of the main lead in plan view as seen in a thickness direction of the semiconductor element. |
| 地址 |
Kyoto-shi JP |
