ELECTRONIC SUBSTRATE

摘要

An electronic substrate includes: an electronic element provided on a first face of a semiconductor substrate having a through hole; a passive element provided on a second face of the semiconductor substrate; a first part of an interconnection pattern provided on the second face of the semiconductor substrate; an insulating layer provided on the second face of the semiconductor substrate; and a second part of the interconnection pattern provided on the insulating layer.

主权项

1. An electronic substrate comprising:
a semiconductor substrate having a first face, a second face, and a through hole; an electronic element provided between the first face and the second face, the electronic element being provided closer to the first face than the second face; a first insulating layer provided over the first face of the semiconductor substrate; a second insulating layer provided over the first insulating layer; a first part of an interconnection pattern provided over the first insulating layer; a second part of the interconnection pattern provided over the second insulating layer; and a third insulating layer provided on an inner wall of the through hole.