发明名称 |
RESIN COMPOSITION FOR SEALING ELECTRICAL ELECTRONIC PARTS, METHOD OF PRODUCING ELECTRICAL ELECTRONIC PARTS, AND SEALED ELECTRICAL ELECTRONIC PARTS |
摘要 |
Provided is a sealant for electrical and electronic parts having excellent fire resistance and adhesiveness, and provided are a method for manufacturing a sealant for electrical and electronic parts suitable therefor and a resin composition for sealing electrical and electronic parts. A resin composition for sealing electrical and electronic parts containing: a polyester (A) obtained by copolymerizing a polyalkylene glycol component and/or a polylactone component; an epoxy resin (B); a polyolefin resin (C); and a phosphoric acid ester (D). |
申请公布号 |
US2015322258(A1) |
申请公布日期 |
2015.11.12 |
申请号 |
US201314424146 |
申请日期 |
2013.08.20 |
申请人 |
TOYOBO CO., LTD. |
发明人 |
WATANABE Yosuke;SHIGA Kenji |
分类号 |
C08L67/02;H01L23/29;H01L23/31;B29C45/14 |
主分类号 |
C08L67/02 |
代理机构 |
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代理人 |
|
主权项 |
1. A resin composition for sealing electrical and electronic parts, comprising:
a copolymerized polyester (A) containing a polyalkylene glycol component and/or a polylactone component; an epoxy resin (B); a polyolefin resin (C); and a phosphoric ester (D). |
地址 |
Osaka JP |