发明名称 RESIN COMPOSITION FOR SEALING ELECTRICAL ELECTRONIC PARTS, METHOD OF PRODUCING ELECTRICAL ELECTRONIC PARTS, AND SEALED ELECTRICAL ELECTRONIC PARTS
摘要 Provided is a sealant for electrical and electronic parts having excellent fire resistance and adhesiveness, and provided are a method for manufacturing a sealant for electrical and electronic parts suitable therefor and a resin composition for sealing electrical and electronic parts. A resin composition for sealing electrical and electronic parts containing: a polyester (A) obtained by copolymerizing a polyalkylene glycol component and/or a polylactone component; an epoxy resin (B); a polyolefin resin (C); and a phosphoric acid ester (D).
申请公布号 US2015322258(A1) 申请公布日期 2015.11.12
申请号 US201314424146 申请日期 2013.08.20
申请人 TOYOBO CO., LTD. 发明人 WATANABE Yosuke;SHIGA Kenji
分类号 C08L67/02;H01L23/29;H01L23/31;B29C45/14 主分类号 C08L67/02
代理机构 代理人
主权项 1. A resin composition for sealing electrical and electronic parts, comprising: a copolymerized polyester (A) containing a polyalkylene glycol component and/or a polylactone component; an epoxy resin (B); a polyolefin resin (C); and a phosphoric ester (D).
地址 Osaka JP