发明名称 |
SUBSTRATE BLOCK FOR PoP PACKAGE |
摘要 |
A substrate block is provided that has an increased width. The substrate block comprises two substrate bars, and the substrate bars each comprise a substrate and a plurality of filled vias through the substrate. The substrate block may be used to manufacture package substrates, and these package substrate may be incorporated into a PoP structure. The package substrate includes a carrier having a plurality of vertical interconnections and a bar coupled to the vertical interconnections. |
申请公布号 |
WO2015171636(A1) |
申请公布日期 |
2015.11.12 |
申请号 |
WO2015US29280 |
申请日期 |
2015.05.05 |
申请人 |
QUALCOMM INCORPORATED |
发明人 |
WE, HONG BOK;KIM, DONG WOOK;LEE, JAE SIK;GU, SHIQUN;RADOJCIC, RATIBOR |
分类号 |
H01L23/498;H01L21/56;H01L23/00;H01L23/538;H01L25/00;H01L25/10 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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