SUBSTRATE CLEANING DEVICE, SUBSTRATE CLEANING METHOD, AND MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a substrate cleaning device which prevents electrification of an insulative substrate during cleaning, and to provide a substrate cleaning method and a manufacturing method of a semiconductor element.SOLUTION: A substrate cleaning device 100 includes: a substrate holding part 120 which holds a wafer S1; a motor 150 which rotationally drives the substrate holding part 120; a first cleaning fluid supply part 160 which supplies a first cleaning fluid to a first surface S1a of the wafer S1; and a second cleaning fluid supply part 180 which supplies a second cleaning fluid to a second surface S1b of the wafer S1. The substrate cleaning device 100 includes a cleaning fluid confluent region R1 where the first cleaning fluid joins the second cleaning fluid. The cleaning fluid confluent region R1 is positioned at the outer side relative to an outer surface S1c of the wafer S1.