LED LEADFRAME OR LED SUBSTRATE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING LED LEADFRAME OR LED SUBSTRATE

摘要

An LED leadframe or LED substrate includes a main body portion having a mounting surface for mounting an LED element thereover. A reflection metal layer serving as a reflection layer for reflecting light from the LED element is disposed over the mounting surface of the main body portion. The reflection metal layer comprises an alloy of platinum and silver or an alloy of gold and silver. The reflection metal layer efficiently reflects light emitted from the LED element and suppresses corrosion due to the presence of a gas, thereby capable of maintaining reflection characteristics of light from the LED element.

主权项

1. An LED resin-attached leadframe comprising:
a die pad for mounting an LED element; a lead portion disposed in a spaced relation to the die pad; and an outer resin portion formed on the die pad and the lead portion, wherein the die pad and the lead portion have an opposing surface, respectively, the opposing surface of the die pad and the opposing surface of the lead portion opposing each other over a space between the die pad and the lead portion, the opposing surface of the die pad has a protrusion positioned in a middle portion of the die pad in a thickness direction of the die pad and protruding toward the space, the die pad has a mounting surface for mounting the LED element and a bottom surface located on an opposite side of the mounting surface, in a vertical section of the die pad, a curved line is formed between the protrusion and the bottom surface, the curved line curving toward the mounting surface, and the outer resin portion fills in the space between the die pad and the lead portion.