发明名称 |
COMPOSITION FOR HEAT-DISSIPATION MEMBERS, HEAT-DISSIPATION MEMBER, AND ELECTRONIC DEVICE |
摘要 |
The invention of the present application provides: a composition capable of forming heat-dissipation members having high thermal conductivity; and a heat-dissipation member. The composition for heat-dissipation members includes: a polymerizable liquid crystal compound which has, at both ends, a structure including an oxiranyl group or an oxetanyl group; a curing agent for curing the polymerizable liquid crystal compound; and an inorganic filler formed from a nitride. The curing temperature of the composition for heat-dissipation members is more than or within the temperature range in which the polymerizable liquid crystal compound exhibits a liquid crystal phase, and less than or within the temperature range in which the polymerizable liquid crystal compound exhibits an isotropic phase. A heat-dissipation member formed from this composition is capable of exhibiting excellent thermal conductivity as a result of the synergistic effect of the inorganic filler formed from the nitride and the alignment of the liquid crystal compound. |
申请公布号 |
WO2015170744(A1) |
申请公布日期 |
2015.11.12 |
申请号 |
WO2015JP63316 |
申请日期 |
2015.05.08 |
申请人 |
JNC CORPORATION;OSAKA MUNICIPAL TECHNICAL RESEARCH INSTITUTE |
发明人 |
FUJIWARA, TAKESHI;INAGAKI, JYUNICHI;YADA, YUKITO;OKADA, AKINORI;AGARI, YASUYUKI;HIRANO, HIROSHI;KADOTA, JOJI |
分类号 |
C09K5/14;C08G59/20 |
主分类号 |
C09K5/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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