SEMICONDUCTOR PACKAGE

摘要

A semiconductor package includes a semiconductor chip, an upper structure, and a lower structure. The upper structure is located in the upper part of the semiconductor chip. The upper structure has a first thermal expansion coefficient. The lower structure is located in the lower part of the semiconductor chip. The lower structure has a second thermal expansion coefficient which is less than the first thermal expansion coefficient. Therefore, as the expansion of the upper structure is relatively higher than that of the lower structure, the semiconductor package is prevented from becoming convex.