Package on package structure with pillar bump pins and related method thereof

摘要

A package on package (POP) structure includes at least a first package and a second package. The first package has a plurality of pillar bump pins. The second package has a plurality of pads connected to the pillar bump pins, respectively. A method of forming a package on package (POP) structure includes at least the following steps: providing a first package with a plurality of pillar bump pins; providing a second package with a plurality of pads; and forming the POP structure by connecting the pillar bump pins to the pads.