| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a device in which a circuit is formed on a resin film more inexpensively and with higher producibility than before. <P>SOLUTION: This method for manufacturing a device includes: a step of applying a liquid polyimide resin composition onto a carrier substrate and drying the resultant coating film to form a solid polyimide resin film on the carrier substrate; a step of forming a circuit on the polyimide resin film; and a step of peeling the polyimide resin film in which a circuit is formed from the carrier substrate, in which the liquid polyimide resin composition contains a polyimide resin containing a repeating unit represented by Formula (1) (where R<SP POS="POST">1</SP>represents a divalent organic group), and a solvent. <P>COPYRIGHT: (C)2013,JPO&INPIT |
