| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a plasma treatment apparatus and a surface treatment method for a base material capable of reducing production cost. <P>SOLUTION: The plasma treatment apparatus is equipped with a chamber 1, a base material holder 3 arranged in the chamber 1 and supporting a base material 2, a gas introduction path connected to the chamber 1 and introducing treating gas for etching into the chamber 1, and a high-frequency power source 4 for supplying high-frequency output of 50 to 500 kHz into the chamber 1, and produces plasma of the treating gas for etching in the chamber 1 by the high-frequency output supplied from the high-frequency power source 4 to remove a surface layer of the base material 2. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
