| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a prepreg, a laminate, and an electronic component in which filler is uniformly dispersed. <P>SOLUTION: The prepreg comprises a fiber base material impregnated with a resin composition containing filler and a thermosetting resin. The filler shows such a property that under the condition of impregnating the fiber base material with the above resin composition, surface charges of the filler have a sign different from that of surface charges of the fiber base material. The laminate is obtained by laminating at least one sheet of the prepreg. The electronic component comprises the laminate and a semiconductor device mounted on the laminate. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
