半導体発光素子搭載用リードフレーム材用スパッタリング装置および半導体発光素子搭載用リードフレーム材の製造方法,申请号JP20120076316-传众专利搜索

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发明名称	半導体発光素子搭載用リードフレーム材用スパッタリング装置および半導体発光素子搭載用リードフレーム材の製造方法
摘要
申请公布号	JP5810427(B2)	申请公布日期	2015.11.11
申请号	JP20120076316	申请日期	2012.03.29
申请人		发明人
分类号	C23C14/56;H01L23/48;H01L33/62	主分类号	C23C14/56
代理机构		代理人
主权项
地址

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