| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead frame for mounting an LED element, capable of preventing infiltration of resin material along one side of a lead frame, or flowing-in of the resin material into a short gap between the lead frame and a metal die. <P>SOLUTION: A lead frame 10 for mounting an LED element includes a frame body 13 and many package regions 14 which are provided in the frame body 13 and contain die pads 25 on each of which an LED element 21 is mounted and a lead part 26 adjoining the die pad 25. In a region 17 that corresponds to a runner 84 into which resin material 23c for reflection resin 23 is injected, in the outer periphery of the frame body 13, a slope 70 is provided whose cross section gradually lowers outways from a surface 13e toward a rear surface 13f. The slope 70 prevents, at the time of molding of the reflection resin 23, the resin material 23c from infiltrating along the outer periphery of the frame body 13 or the resin material 23c from flowing into the gap between the lead frame 10 and a lower metal die 82. <P>COPYRIGHT: (C)2013,JPO&INPIT |
