发明名称 VACUUM PLATING METHOD AND METAL EVAPORATING DEVICE
摘要 PURPOSE:To carry out plating of prescribed patterns on a base plate and improve the yield of evaporating metal by providing a sleeve having a through- hole at the top end of a crucible, maintaining the sleeve at high temp. thereby evaporating the metal from the crucible. CONSTITUTION:A sleeve 7 having a through-hole 8 in a vertical direction is fitted to the top end of a crucible 2 provided with a heater 3 on the outside circumference. A heater 9 is provided on the outside of this sleeve 7, and both heaters 3, 9 are regulated to maintain the temp. of the sleeve 7 at temp. higher by >=50 deg.C than the temp. of the crucible 2. The metal 4 in the crucible 2 is heated to evaporate by using such metal evaporating device. Thereby, the sticking of the metal vapor evaporating in the crucible 2 on the inside wall of the through- hole 8 is prevented, and the stuck metal vapor evaporates instantaneously. The plating of the shape resembling to the sectional shape of the through-hole 8 is obtained on the base plate. Further, when the base plate is moved, the linear partial plating is obtained.
申请公布号 JPS57131362(A) 申请公布日期 1982.08.14
申请号 JP19810016361 申请日期 1981.02.06
申请人 FURUKAWA DENKI KOGYO KK 发明人 SAKAMOTO MUTSUO
分类号 C23C14/04;C23C14/24 主分类号 C23C14/04
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