发明名称 EPOXY RESIN COMPOSITION AND PREPREG AND COPPER CLAD LAMINATE MANUFACTURED BY USING THE SAME
摘要 <p>Epoxy resin composition and prepreg and copper clad laminate manufactured by using the same are provided. The epoxy resin composition comprises the following essential components: (A) epoxy resin containing naphthol structure; (B) active ester curing agent; (C) curing accelerant. The epoxy composition in this invention can be used to prepare epoxy resin condensate with low water absorption and low dielectric loss value. The prepreg and copper clad laminate manufactured have good dielectric properties, moisture and heat resistance performance and high glass transition temperature.</p>
申请公布号 EP2770024(A4) 申请公布日期 2015.11.11
申请号 EP20110874126 申请日期 2011.10.18
申请人 GUANGDONG SHENGYI SCI. TECH CO., LTD 发明人 ZENG, XIANPING
分类号 C08L63/00;C08G59/20;C08G59/24;C08G59/32;C08G59/40;C08G59/42;H05K1/03 主分类号 C08L63/00
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