发明名称 |
EPOXY RESIN COMPOSITION AND PREPREG AND COPPER CLAD LAMINATE MANUFACTURED BY USING THE SAME |
摘要 |
<p>Epoxy resin composition and prepreg and copper clad laminate manufactured by using the same are provided. The epoxy resin composition comprises the following essential components: (A) epoxy resin containing naphthol structure; (B) active ester curing agent; (C) curing accelerant. The epoxy composition in this invention can be used to prepare epoxy resin condensate with low water absorption and low dielectric loss value. The prepreg and copper clad laminate manufactured have good dielectric properties, moisture and heat resistance performance and high glass transition temperature.</p> |
申请公布号 |
EP2770024(A4) |
申请公布日期 |
2015.11.11 |
申请号 |
EP20110874126 |
申请日期 |
2011.10.18 |
申请人 |
GUANGDONG SHENGYI SCI. TECH CO., LTD |
发明人 |
ZENG, XIANPING |
分类号 |
C08L63/00;C08G59/20;C08G59/24;C08G59/32;C08G59/40;C08G59/42;H05K1/03 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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