| 摘要 |
It is determined whether a mount component is a component 43 to be mounted on a pad pattern 42 or a component 46 to be mounted on a solder printing pattern 45 formed by performing screen printing on a pad pattern 44. The component 43 is mounted on the pad pattern 42 by correcting a mounting position of the component 43 with respect to the pad pattern 42 based on a position of a board mark 47 as a fiducial point which is imaged by a mark camera 37 and is subjected to image processing when it is determined that the mount component is the component 43 to be mounted on the pad pattern 42. Meanwhile, the component 46 is mounted on the solder printing pattern 45 by correcting the mounting position of the component 46 with respect to the solder printing pattern 45 based on a position of a solder mark 48 as a fiducial point which is imaged by the mark camera 37 and is subjected to image processing when it is determined that the mount component is the component 46 to be mounted on the solder printing pattern 45. |
