发明名称 |
Conductive ball mounting method and surplus ball removing apparatus |
摘要 |
<p>A conductive ball mounting method of the present invention, includes a step of, arranging a mask (40) in which an opening portion (40a) is provided, on a substrate (1) including a connection pad (C1), arranging a conductive ball (62) on the connection pad (C1) through the opening portion (40a) of the mask (40) by supplying the conductive ball (62) onto the mask (40), separating the substrate (1) and the mask (40), in the step, an extra conductive ball (62) left on the mask (40) drops through the opening portion (40a) of the mask (40), thereby a surplus ball (62a) is mounted on the substrate (1), and removing the surplus ball (62a) on the substrate (1) by making the surplus ball (62a) adhere onto an adhering head (78).</p> |
申请公布号 |
EP2073258(B1) |
申请公布日期 |
2015.11.11 |
申请号 |
EP20080170698 |
申请日期 |
2008.12.04 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
SUNOHARA, FUMIO;IIDA, KIYOAKI;KOBAYASHI, MASAKAZU;MARUYAMA, KESAMI |
分类号 |
H01L21/48;B23K3/06;H05K3/34 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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