| 摘要 |
<p> The purpose of the present invention is to provide a solder material in which the amount of radiatedα-rays can be reduced. A solder ball (1A), which is a solder material, is provided with a nuclei layer (2A) having sufficient diameter to maintain distance between a bonding object and a bonded object, and a solder layer (3A) coating the nuclei layer (2A). The solder layer (3A) is configured from a metal material that: has a melting point at a temperature at which the nuclei layer (2A) does not melt, the metal material solidifying and thereby bonding the bonding object and the bonded object to each other; and has sufficient thickness to blockα-rays radiated from the nuclei layer (2A).</p> |
