Resin composition for printed-wiring board

摘要

A resin composition is provided which comprises a polyimide resin, a thermosetting resin, and a filler, wherein the ratio of the thermosetting resin to the total content of the resin composition excluding the filler is between 10 and 90 % by weight. The polyimide resin contains a first repeat unit represented by formula (I) and a second repeat unit represented by formula (III), wherein the ratio of the second repeat unit to the polyimide resin is between 5 and 80 mol%.