| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a technology for bonding a functional substrate having a functional organic compound layer and container body members while maintaining functions of the functional organic compound layer in a bonding method therefor accompanied by heat and pressure such as ultrasonic welding or injection molding. <P>SOLUTION: In the method, the method includes the following process. A functional substrate (140) comprises a resin-made base material layer (502) and a functional organic compound layer (501). Resin-made container body members (101, 102, 103, 105, and 106) and the functional substrate are bonded to each other by melting and integrating resins by ultrasonic melting, in-mold molding or the like at parts where surfaces of the members are in contact with the surface of the base-material layer of the functional substrate or the peripheral edge (640 or 610) of the functional organic compound layer. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
