| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a technique capable of downsizing an electrode pad formed on a surface of a semiconductor element more than conventional semiconductor devices. <P>SOLUTION: A manufacturing method of a semiconductor device disclosed herein makes a signal pad 40 formed on a surface of a semiconductor element 20 face a tip of a claw part 62 provided on a one end side of a lead frame 60 and then seals the semiconductor element 20, a main pad 30, the signal pad 40, one end side of the lead frame 60, and one end side of a bonding wire 70 with a mold resin by a compression mold method with the signal pad 40 and the tip of the claw part 62 facing with each other. The compression mold electrically connects the lead frame 60 and the signal pad 40 by biasing the tip of the claw part 62 in a direction of the signal pad 40 by its molding pressure. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
