Polymeric binders incorporating light-detecting elements

摘要

In accordance with certain embodiments, semiconductor dies are embedded within polymeric binder to form, e.g., light-emitting dies and/or composite wafers containing multiple light-emitting dies embedded in a single volume of binder.

主权项

1. An electronic device comprising:
a solid shaped volume of a polymeric binder; suspended within the polymeric binder, a semiconductor die having a first face, a second face opposite the first face, and at least one sidewall spanning the first and second faces, the semiconductor die being a bare-die light-detecting element comprising at least one semiconductor layer configured to absorb light over a detected wavelength range and produce electrical charge therefrom; and disposed on the first face of the semiconductor die, at least two spaced-apart contacts each (i) having a free terminal end not covered by the polymeric binder, (ii) being available for electrical connection, and (iii) contacting an active semiconductor layer of the semiconductor die, wherein at least a portion of the polymeric binder is transparent to a wavelength of light within the detected wavelength range.