发明名称 |
Method of producing aluminum structure and aluminum structure |
摘要 |
Provided is a method of producing an aluminum structure using a porous resin molded body having a three-dimensional network structure, with which it is possible to form an aluminum structure having a low oxide content in the surface of aluminum (i.e., having an oxide film with a small thickness), and in particular, it is possible to obtain an aluminum porous body that has a large area. The method includes a step of preparing an aluminum-coated resin molded body in which an aluminum layer is formed, directly or with another layer therebetween, on a surface of a resin molded body composed of urethane, and a heat treatment step in which the aluminum-coated resin molded body is subjected to heat treatment at a temperature equal to or higher than 270° C. and lower than 660° C. to decompose the resin molded body. |
申请公布号 |
US9184448(B2) |
申请公布日期 |
2015.11.10 |
申请号 |
US201213363694 |
申请日期 |
2012.02.01 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD. |
发明人 |
Kimura Kotaro;Hosoe Akihisa;Sugihara Takayasu;Ohama Osamu;Okuno Kazuki;Awazu Tomoyuki;Nitta Koji |
分类号 |
C25D11/04;H01M4/80;C25D1/08;C25D3/66;C25D5/56;H01G11/30;H01G11/68;H01G11/70;H01G11/86;H01M4/66 |
主分类号 |
C25D11/04 |
代理机构 |
Drinker Biddle & Reath LLP |
代理人 |
Drinker Biddle & Reath LLP |
主权项 |
1. A method of producing an aluminum structure comprising:
a step of preparing an aluminum-coated resin molded body in which an aluminum layer is formed, directly or with another layer therebetween, on a surface of a resin molded body composed of urethane; and a heat treatment step in which the aluminum-coated resin molded body is subjected to heat treatment at a temperature equal to or higher than 380° C. and lower than 660° C. to decompose the resin molded body, wherein the step of preparing an aluminum-coated resin molded body includes a conductivity-imparting step in which electrical conductivity is imparted to the surface of the resin molded body and a step of forming the aluminum layer by performing aluminum plating in a molten salt, and the thickness of the aluminum layer is 1 to 100 μm. |
地址 |
Osaka-shi, Osaka JP |