Double side polisher with platen parallelism control

摘要

A platen for polishing a surface of a wafer has a reaction plate, a polishing plate, and a bladder. The reaction plate has a top and bottom surface, and defines a longitudinal axis. The polishing plate is positioned coaxially with the reaction plate. The polishing plate has a second top surface and a second bottom surface. The second top surface is adjacent to the bottom surface of the reaction plate. The bladder is coaxially located along a radially outer portion of either the top or bottom surface of the reaction plate. The bladder is connected with the polishing plate and able to expand to deform the polishing plate with respect to the bottom surface of the reaction plate.

主权项

1. A platen for polishing a surface of a wafer, the platen comprising:
a reaction plate having a top surface and a bottom surface and defining a longitudinal axis extending therethrough; a polishing plate positioned coaxially with the reaction plate, the polishing plate having a second top surface and a second bottom surface, the second top surface being adjacent to the bottom surface of the reaction plate; a bladder disposed along a radially outer portion of one of the top surface and the bottom surface of the reaction plate, the bladder being coaxial with the reaction plate, the bladder being connected with the polishing plate for deforming the polishing plate with respect to the bottom surface of the reaction plate; and an annular ring of fasteners connecting the reaction plate with the polishing plate, the annular ring of fasteners being spaced radially inward from the bladder to allow an outer edge of the polishing plate to move longitudinally with respect to the bottom surface of the reaction plate.