发明名称 レーザ処理装置及び方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser processing apparatus and method by which more effective processing to a workpiece is made attainable by using a laser. <P>SOLUTION: The laser processing apparatus which processes the workpiece by irradiating the surface of a workpiece 100 with a laser beam under the presence of liquid has: a gas supply mechanism 34; mechanisms 36, 38, 39 for producing a gas-containing liquid, which produces the gas-containing liquid by adding the gas from the gas supply mechanism to the liquid; and a processing state-forming mechanism 15c for forming the state where at least a region to be processed of the workpiece 100 is filled up with the gas-containing liquid from the gas-containing liquid-producing mechanism in a processing tank 11. The laser processing apparatus is constituted so as to irradiate the region to be processed of the surface of the workpiece 100 with the laser beam in the state where the gas-containing liquid is filled up. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5809445(B2) 申请公布日期 2015.11.10
申请号 JP20110114374 申请日期 2011.05.23
申请人 发明人
分类号 B23K26/122;B23K26/142;H01L21/302 主分类号 B23K26/122
代理机构 代理人
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