发明名称 剥離システム
摘要 <p>A delamination system delaminates a laminated substrate, in which a first substrate and a second substrate are bonded together, into the first substrate and the second substrate. The delamination system has a first processing block processing the laminated substrate or the delaminated first substrate and a second processing block processing the delaminated second substrate. The first processing block has a delamination station having a delamination device that delaminates the laminated substrate transferred by a first transfer device into the first substrate and the second substrate. The second processing block has a second cleaning station and a delivery station. The second cleaning station has a second cleaning device cleaning the delaminated second substrate. The delivery station is disposed between the second cleaning station and the delamination station. The delivery station receives the delaminated second substrate from the delamination station and delivers it to the second cleaning station.</p>
申请公布号 JP5806185(B2) 申请公布日期 2015.11.10
申请号 JP20120197212 申请日期 2012.09.07
申请人 发明人
分类号 H01L21/02;H01L21/304;H01L21/677;H01L21/683 主分类号 H01L21/02
代理机构 代理人
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