发明名称 |
Semiconductor device packages including thermally insulating materials and methods of making and using such semiconductor packages |
摘要 |
Semiconductor devices may include a first semiconductor die comprising a heat-generating region located at a periphery thereof. A second semiconductor die is attached to the first semiconductor die. At least a portion of the heat-generating region is located laterally outside a footprint of the second semiconductor die. A thermally insulating material is located on a side surface of the second semiconductor die. Methods of forming semiconductor devices may involve attaching a second semiconductor die to a first semiconductor die. The first semiconductor die includes a heat-generating region at a periphery thereof. At least a portion of the heat-generating region is located laterally outside a footprint of the second semiconductor die. A thermally insulating material is located on a side surface of the second semiconductor die. |
申请公布号 |
US9184105(B2) |
申请公布日期 |
2015.11.10 |
申请号 |
US201414334870 |
申请日期 |
2014.07.18 |
申请人 |
Micron Technology, Inc. |
发明人 |
Groothuis Steven;Li Jian;Luo Shijian |
分类号 |
H01L23/02;H01L23/22;H01L21/00;H01L23/34;H01L23/367;H01L23/31;H01L25/065;H01L23/433;H01L25/18 |
主分类号 |
H01L23/02 |
代理机构 |
TraskBritt |
代理人 |
TraskBritt |
主权项 |
1. A semiconductor device, comprising:
a first semiconductor die comprising a heat-generating region located at a periphery of the first semiconductor die; a second semiconductor die physically attached and electrically connected to the first semiconductor die, at least a portion of the heat-generating region located laterally outside a footprint of the second semiconductor device; a thermally insulating material located on a side surface of the second semiconductor die; and a thermally conductive overmold located at least partially over the first and second semiconductor dice and the thermally insulating material; wherein a thermal conductivity of the thermally insulating material is less than a thermal conductivity of the thermally conductive overmold. |
地址 |
Boise ID US |