MEMS devices and methods of forming the same

摘要

A device includes a substrate, a routing conductive line over the substrate, a dielectric layer over the routing conductive line, and an etch stop layer over the dielectric layer. A Micro-Electro-Mechanical System (MEMS) device has a portion over the etch stop layer. A contact plug penetrates through the etch stop layer and the dielectric layer. The contact plug connects the portion of the MEMS device to the routing conductive line. An escort ring is disposed over the etch stop layer and under the MEMS device, wherein the escort ring encircles the contact plug.

主权项

1. A method comprising:
forming a routing conductive line over a substrate; forming a dielectric layer over the routing conductive line; forming an escort ring over the dielectric layer; forming a sacrificial layer over the escort ring; forming an opening in the sacrificial layer, the escort ring, and the dielectric layer, wherein the routing conductive line is exposed through the opening; forming a contact plug in the opening; forming a conductive component over and connected to the contact plug, wherein the conductive component forms a portion of a Micro-Electro-Mechanical System (MEMS) device; and removing the sacrificial layer to form an air gap.