| 发明名称 |
Pressure activated high density switch array |
| 摘要 |
Some of the embodiments of the present disclosure provide a method for operating a testing system to test a device, wherein the testing system comprises a pressing module, the method comprising attaching the device to the pressing module of the testing system; while the testing system operates in a first mode of testing, pressing the pressing module to a first position such that (i) the device is electrically coupled to a first component via a first pin, and (ii) the device is electrically isolated from a second component via a second pin; and while the testing system operates in a second mode of testing, pressing the pressing module to a second position such that (i) the device is electrically isolated from first component via the first pin, and (ii) the device is electrically coupled to the second component via the second pin. |
| 申请公布号 |
US9182440(B1) |
申请公布日期 |
2015.11.10 |
| 申请号 |
US201313747800 |
申请日期 |
2013.01.23 |
| 申请人 |
Marvell International Ltd. |
发明人 |
Leung Yat Fai |
| 分类号 |
G01R31/28;G01R31/04;G01R3/00;G01R1/067 |
主分类号 |
G01R31/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for operating a testing system to test a device, wherein the testing system comprises a pressing module, the method comprising:
attaching the device to the pressing module of the testing system; while the testing system operates in a first mode of testing, pressing the pressing module to a first position such that (i) the device is electrically coupled to a first component via a first pin, and (ii) the device is electrically isolated from a second component via a second pin; and while the testing system operates in a second mode of testing, pressing the pressing module to a second position such that (i) the device is electrically isolated from first component via the first pin, and (ii) the device is electrically coupled to the second component via the second pin. |
| 地址 |
Hamilton BM |
