| 发明名称 | Wafer pod and wafer positioning mechanism thereof | ||
| 摘要 | Embodiments of mechanisms of a wafer pod including a wafer positioning mechanism are provided. The wafer positioning mechanism includes a base including a blocking portion, and a linking bar pivoted on the base and including a resilient portion. The wafer positioning mechanism also includes a pushing element pivoted on the linking shaft. Further, when the pushing element is at a retaining position, the resilient portion abuts against the blocking portion, and a force generated by the linking bar is applied to the pushing element. | ||
| 申请公布号 | US9184077(B2) | 申请公布日期 | 2015.11.10 |
| 申请号 | US201314040888 | 申请日期 | 2013.09.30 |
| 申请人 | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD | 发明人 | Yang Sung-Chun;Peng Ying-Chi;Yang Yao-Pin |
| 分类号 | H01L21/673 | 主分类号 | H01L21/673 |
| 代理机构 | McClure, Qualey & Rodack, LLP | 代理人 | McClure, Qualey & Rodack, LLP |
| 主权项 | 1. A wafer positioning mechanism, comprising: a base comprising a blocking portion; a linking bar, pivoted on the base, comprising a resilient portion; a linking shaft; and a pushing element pivoted on the linking shaft, wherein when the pushing element is at a retaining position, the resilient portion abuts against the blocking portion, and a force generated by the linking bar is applied to the pushing element. | ||
| 地址 | Hsin-Chu TW | ||