发明名称 Low firing temperature copper composition
摘要 An electroconductive paste comprising first copper particles having a specific surface area of about 0.15-1.0 m2/g, second copper particles having a specific surface area of about 0.5-2.5 m2/g, glass frit and an organic vehicle. According to another embodiment of the invention, the first copper particles are about 60-80 wt. % of the paste, while the content of the second copper particles is up to about 20 wt. % of the paste. According to another embodiment, the glass frit is lead-free and is about 1-10 wt. % of the paste. Preferably, the glass frit comprises a boron-zinc-barium oxide glass frit. According to another embodiment, the paste further comprises copper oxide. Another embodiment of the invention relates to an electroconductive paste comprising about 60-95 wt. % copper component, a boron-zinc-barium oxide glass frit, and an organic vehicle.
申请公布号 US9183967(B2) 申请公布日期 2015.11.10
申请号 US201314022641 申请日期 2013.09.10
申请人 Heraeus Precious Metals North America Conshohocken LLC 发明人 Shahbazi Samson;Challingsworth Mark;Grabey Steve;Persons Ryan
分类号 H01B1/22;C09D5/24;H05K1/09;H05K3/12;C03C8/14 主分类号 H01B1/22
代理机构 Blank Rome LLP 代理人 Blank Rome LLP
主权项 1. An electroconductive paste comprising: a copper component comprising first copper particles having a specific surface area of about 0.15-1.0 m2/g, and up to about 20 wt % second copper particles having a specific surface area of about 0.5-2.5 m2/g, based upon 100% total weight of the paste, wherein the specific surface area of the first copper particles is different from the specific surface area of the second copper particles; glass frit; and organic vehicle.
地址 West Conshohocken PA US