Semiconductor integrated device with mechanically decoupled active area and related manufacturing process

摘要

A semiconductor integrated device is provided with: a die having a body of semiconductor material with a front surface, and an active area arranged at the front surface; and a package having a support element carrying the die at a back surface of the body, and a coating material covering the die. The body includes a mechanical decoupling region, which mechanically decouples the active area from mechanical stresses induced by the package; the mechanical decoupling region is a trench arrangement within the body, which releases the active area from an external frame of the body, designed to absorb the mechanical stresses induced by the package.

主权项

1. A semiconductor integrated device comprising:
a die having a body of semiconductor material with a front surface, a back surface, and an external frame, an active area arranged at the front surface, a coating material covering a portion of the front surface, the body including a trench arrangement that is configured to mechanically decouple the active area from stresses, wherein the trench arrangement is configured to release the active area from the external frame of the body; and a package that includes mold compound and a support element, the back surface of the die being located on the support element, the external frame being configured to absorb the stresses induced by the package.